SABIC, tus thawj coj thoob ntiaj teb hauv kev lag luam tshuaj, tau qhia LNP Thermocomp OFC08V compound, cov khoom siv zoo tagnrho rau 5G hauv paus chaw nres tsheb dipole kav hlau txais xov thiab lwm yam kev siv hluav taws xob / hluav taws xob.
Qhov kev sib xyaw tshiab no tuaj yeem pab kev lag luam txhim kho lub teeb yuag, kev lag luam, txhua tus kav hlau txais xov yas tsim uas pab txhawb kev xa tawm ntawm 5G infrastructure.Nyob rau hauv ib lub sijhawm ntawm kev loj hlob hauv nroog loj thiab cov nroog ntse, muaj qhov xav tau ceev nrawm rau kev muaj 5G tes hauj lwm los muab kev sib txuas ceev, txhim khu kev qha rau ntau lab tus neeg nyob hauv.
"Los pab kom paub txog cov lus cog tseg ntawm 5G qhov nrawm dua, cov ntaub ntawv ntau dua, thiab qis qis qis, RF kav hlau txais xov cov tuam txhab tau hloov pauv lawv cov qauv tsim, cov ntaub ntawv thiab cov txheej txheem," tus neeg hais.
"Peb tab tom pab peb cov neeg siv khoom yooj yim ntawm kev tsim cov kav hlau txais xov RF, uas yog siv ntau pua arrays hauv cov kav hlau txais xov.Peb qhov kev ua tau zoo tshiab tshaj plaws LNP Thermocomp compounds pab ua kom yooj yim tsis yog los ntawm kev zam kev tsim khoom tom qab, tab sis kuj xa cov kev ua tau zoo tshaj plaws hauv ntau qhov chaw tseem ceeb.Los ntawm kev tsim cov ntaub ntawv tshiab txuas ntxiv rau 5G infrastructure, SABIC lub hom phiaj txhawm rau txhawm rau nthuav dav ntawm cov thev naus laus zis tshiab txuas ntxiv no. "
LNP Thermocomp OFC08V compound yog iav fiber ntau cov khoom siv raws li polyphenylene sulfide (PPS) cob.Nws nta zoo heev electroplating zog siv laser ncaj structuring (LDS), muaj zog txheej adhesion, zoo warpage tswj, siab kub tsis kam, thiab ruaj khov dielectric thiab xov tooj cua zaus (RF) zog.Qhov kev sib xyaw tshwj xeeb ntawm cov khoom no tso cai rau kev txhaj tshuaj moldable dipole kav hlau txais xov tshiab tsim uas muaj qhov zoo dua li cov ntawv luam tawm Circuit Board (PCB) sib dhos thiab xaiv plating ntawm cov yas.
Cov txiaj ntsig kev ua tau zoo
Tus tshiab LNP Thermocomp OFC08V compound yog tsim los siv rau hauv cov hlau plating siv LDS.Cov khoom siv muaj lub qhov rais dav laser ua, uas ua kom yooj yim plating thiab ua kom zoo ib yam ntawm plating kab dav, pab kom ruaj khov thiab zoo ib yam kav hlau txais xov.Muaj zog adhesion ntawm cov yas thiab hlau txheej tsis txhob delamination, txawm tias tom qab thermal aging thiab lead-free reflow soldering.Txhim kho qhov kev ruaj ntseg thiab qis dua kev sib tw piv rau cov iav fiber ntau ntxiv PPS qib pab txhawb kev kho kom zoo ntawm cov metallization thaum lub sij hawm LDS, nrog rau kev sib dhos kom raug.
Vim cov khoom no, LNP Thermocomp OFC08V compound tau teev los ntawm German laser manufacturing daws teeb meem LPKF Laser & Electronics raws li cov ntawv pov thawj thermoplastic rau LDS hauv lub tuam txhab cov ntaub ntawv pov thawj.
"Tag nrho cov yas dipole kav hlau txais xov ua nrog iav fiber ntau zog PPS yog hloov cov qauv tsim vim tias lawv tuaj yeem txo qhov hnyav, ua kom yooj yim sib dhos, thiab muab ntau dua plating uniformity," tus neeg hais."Txawm li cas los xij, PPS cov khoom siv yuav tsum muaj txheej txheem metallization nyuaj.Txhawm rau daws qhov kev sib tw no, lub tuam txhab tau tsim ib qho tshiab, tshwj xeeb PPS-raws li kev sib xyaw nrog LDS muaj peev xwm thiab muaj zog sib txuas. "
Cov txheej txheem xaiv electroplating nyuaj rau cov yas uas tau siv dav niaj hnub no suav nrog ntau cov kauj ruam, thiab LDS-enabled LNP Thermocomp OFC08V compound muaj ntau dua simplicity thiab ntau dua productivity.Tom qab ib feem yog txhaj molded, LDS tsuas yog yuav tsum tau laser txoj kev thiab electroless plating.
Tsis tas li ntawd, tus tshiab LNP Thermocomp OFC08V compound muaj tag nrho cov txiaj ntsig kev ua tau zoo ntawm cov iav puv PPS, suav nrog kev ua haujlwm siab thermal rau PCB los ua ke siv cov cuab yeej siv saum npoo av, nrog rau cov nplaim hluav taws kub nyhiab (UL-94 V0 ntawm 0.8 hli).Tsawg dielectric tus nqi (dielectric tas li: 4.0; dissipation yam: 0.0045) thiab ruaj khov dielectric zog, nrog rau kev ua tau zoo RF nyob rau hauv hnyav hnyav, pab txhim kho kev sib kis thiab txuas ntxiv kev pab cuam lub neej.
"Qhov tshwm sim ntawm qhov siab tshaj LNP Thermocomp OFC08V compound tuaj yeem pab txhim kho cov kav hlau txais xov tsim thiab kev ua haujlwm ruaj khov hauv thaj teb, ua kom yooj yim rau cov txheej txheem metallization thiab txo cov nqi rau peb cov neeg siv khoom," tus neeg ntxiv.
Lub sij hawm xa tuaj: Plaub Hlis-25-2022